Robot
Atel has various Robots from a small one to a big one.
To provide robot to using environment.
Handling wafer is back side contactless to quality requirements.
High spped handling
PR1199-300-00421
Link Type Single Arm Robot
| Characteristic |
PR Robot improved the ratio of making to sheet metal body-work.
High rigidity and stable high speed handling be achieved.
Chuck with vacuum suction made in aluminum.
Controller be suitable for slide axis(X axis).
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| Wafer holding method | vacuum suction |
|---|
| Controll method |
Simple operation through serial interface
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PR2111-60-00393
Link Type Double Arm Robot
| Characteristic |
PR Robot improved the ratio of making of sheet metal body-work.
High rigidity and stable high speed handling be achieved.
|
| Wafer holding method | vacuum suction |
|---|
| Control method |
Simple operation through serial interface
|
|---|
SYPR101-00493
6 inch Cassette Handling System
| Characteristic |
Cassette with full of sapphire wafer be able to equip.
Compact body, compact space.
Drive system Driving gripp axis and tilt axis with stepping motor
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| Wafer holding method | vacuum suction |
|---|
| Control method |
Simple operation through serial interface
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FR1200-2440
Foup Handling Robot For Foup Stocker
| Characteristic徴 |
Specially designed for Foup handling 300mm wafer Foup Stocker
Kinematic pin, fiber sensor and clamp mechanism to fix Foup installed in Foup loading stage.
Slide mechanism shifted arm horizontally located.
Function and performance handling Foup with stable high speed perfect.
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| Wafer holding method | vacuum suction |
|---|
| Control method |
Simple operation through serial interface
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LR2000-650-S001
Linear Type Double Arm Robot
| Characteristic |
Compact body, long stroke
Rigid arm mechanics gives high speed operation with superior precision
Used many sheet metal body-work achieve to reduce the cost
2 phase stepping motor be equipped
Optional mounting bracket for custom handing axis
Slide axis is available to control servo motor incremental encoder specification
24 inch 1.1 thickness For FPD glass substrates
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| Wafer holding | vacuum suction |
|---|
| Contorl method |
Simple operation through serial interface
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